LPC43S30FET100数据手册恩XP中文资料规格书

描述 Description

The LPC43S30FET100 is a Arm Cortex-M4 based microcontroller for embeddedapplications which includes an Arm Cortex-M0 coprocessor, 264 kB of SRAM,security features with AES engine, advanced configurable peripherals such as the StateConfigurable Timer/PWM (SCTimer/PWM) and the Serial General-Purpose I/O (SGPIO)interface, two High-speed USB controllers, Ethernet,an external memory controller,and multiple digital and analog peripherals. The LPC43S30FET100 operates at CPUfrequencies of up to 204 MHz.
The Arm Cortex-M4 is a 32-bit core that offers system enhancements such as low power consumption,enhanced debug features, and a high level of support block integration. The Arm Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separatelocal instruction and data buses as well as a third bus for peripherals, and includes aninternal prefetch unit that supports speculative branching. The Arm Cortex-M4 supportssingle-cycle digital signal processing and SIMD instructions. A hardware floating-pointunit is integrated in the core.
The Arm Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core which is code-and tool-compatible with the Cortex-M4 core. The Cortex-M0 coprocessor offers up to 204MHz performance with a simple instruction set and reduced code size. In LPC43Sx0, theCortex-M0 coprocessor hardware multiply is implemented as a 32-cycle iterativemultiplier.

特性 Features

• Cortex-M4 Processor core
• Arm Cortex-M4 processor, running at frequencies of up to 204 MHz.
• Built-in Memory Protection Unit (MPU) supporting eight regions.
• Built-in Nested Vectored Interrupt Controller (NVIC).
• Hardware floating-point unit making the core a Cortex-M4.
• Non-maskable Interrupt (NMI) input.
• JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watchpoints.
• Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
• System tick timer.
• Cortex-M0 Processor core
• Arm Cortex-M0 coprocessor capable of off-loading the main Arm Cortex-M4Fapplication processor.
• Running at frequencies of up to 204 MHz.
• JTAG
• Built-in NVIC.
• On-chip memory
• 264 kB SRAM for code and data use.
• Multiple SRAM blocks with separate bus access. Two SRAM blocks can be powered down individually
• 64 kB ROM containing boot code and on-chip software drivers.
• 64 bit general-purpose OTP memory
• Two banks (256 bit total) One-Time Programmable (OTP) memory for AES keystorage One bank can store an encrypted key for decoding the boot image.
• AES engine for encryption and decryption of the boot image and data with DMAsupport and programmable via a ROM-based API.
• Clock generation unit
• Crystal oscillator with an operating range of 1 MHz to 25 MHz.
• 12 MHz Internal RC (IRC) oscillator trimmed to 1.5 % accuracy over temperatureand voltage.
• Ultra-low power Real-Time Clock (RTC) crystal oscillator.
• Three PLLs allow CPU operation up to the maximum CPU rate without the need fora high-frequency crystal. The second PLL is dedicated to the High-speed USB, thethird PLL can be used as audio PLL.
• Clock output.
• Configurable digital peripherals
• Serial GPIO (SGPIO) interface.
• State Configurable Timer (SCTimer/PWM) subsystem on AHB.
• Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs andoutputs to event driven peripherals like the timers, SCTimer/PWM, and ADC0/1.
• Serial interfaces
• Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to52 MB per second.
• 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for highthroughput at low CPU load. Support for IEEE 1588 time stamping/advanced timestamping (IEEE 1588-2008 v2).
• One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY (USB0).
• One High-speed USB 2.0 Host/Device interface with DMA support, on-chipfull-speed PHY and ULPI interface to external high-speed PHY (USB1).
• USB interface electrical test software included in ROM USB stack.
• Four 550 UARTs with DMA support: one UART with full modem interface; oneUART with IrDA interface; three USARTs support UART synchronous mode and asmart card interface conforming to ISO7816 specification.
• Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controllerexcludes operation of all other peripherals connected to the same bus bridge
• Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMAsupport.
• One SPI controller.
• One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/Opins conforming to the full I²C-bus specification. Supports data rates of up to1 Mbit/s.
• One standard I²C-bus interface with monitor mode and with standard I/O pins.
• Two I²S interfaces, each with DMA support and with one input and one output.
• Digital peripherals
• External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,and SDRAM devices.
• Secure Digital Input Output (SD/MMC) card interface.
• Eight-channel General-Purpose DMA controller can access all memories on theAHB and all DMA-capable AHB slaves.
• Up to 49 General-Purpose Input/Output (GPIO) pins with configurablepull-up/pull-down resistors.
• GPIO registers are located on the AHB for fast access. GPIO ports have DMAsupport.
• Up to eight GPIO pins can be selected from all GPIO pins as edge and levelsensitive interrupt sources.
• Two GPIO group interrupt modules enable an interrupt based on a programmablepattern of input states of a group of GPIO pins.
• Four general-purpose timer/counters with capture and match capabilities.
• Repetitive Interrupt timer (RI timer).
• Windowed watchdog timer (WWDT).
• Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytesof battery powered backup registers.
• Alarm timer; can be battery powered.
• Analog peripherals
• One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.
• Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.Up to eight input channels per ADC.
• Unique ID for each device.
• Power
• Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator forthe core supply and the RTC power domain.
• RTC power domain can be powered separately by a 3 V battery supply.
• Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down.
• Processor wake-up from Sleep mode via wake-up interrupts from variousperipherals.
• Wake-up from Deep-sleep, Power-down, and Deep power-down modes viaexternal interrupts and interrupts generated by battery powered blocks in the RTCpower domain.
• Brownout detect with four separate thresholds for interrupt and forced reset.
• Power-On Reset (POR).
• Available as TFBGA100 package.

应用 Application

通信集线器
汽车电子零件市场
电源管理
消费电子医疗设备
嵌入式音频应用
工业控制
工业自动化
白色家电