INFRARED LAMP LED

文件：376.49 Kbytes 页数：14 Pages

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首尔半导体

BLUE OVAL LAMP LED

Description Lamp LEDs are effective in hot thermal and humid condition. This high brightness and weather-resistant packaging design makes these Lamp LEDs ideal for Outdoor applications such as traffic signals, variable message signs and backlighting for transparent sign panels. • Non-standoff le

文件：392.15 Kbytes 页数：14 Pages

SEOUL

首尔半导体

CYAN LAMP LED

文件：360.46 Kbytes 页数：13 Pages

SEOUL

首尔半导体

RED OVAL LAMP LED

文件：392.32 Kbytes 页数：14 Pages

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首尔半导体

BLUE OVAL LAMP LED

文件：390.41 Kbytes 页数：14 Pages

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首尔半导体

RED OVAL LAMP LED

文件：392.32 Kbytes 页数：14 Pages

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首尔半导体

RED LAMP LED

文件：378.31 Kbytes 页数：14 Pages

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首尔半导体

Infrared LAMP LED

文件：285.42 Kbytes 页数：13 Pages

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首尔半导体

SPECIFICATION FOR APPROVAL

Coming Soon. If you have some information on related parts, please share useful information by adding links below.

文件：732.14 Kbytes 页数：28 Pages

PHI

飞利浦

TD-HSPA/GGE FP基带芯片

•业内首个TD-SCDMA/GSM+GSM双卡双待方案；\r\n\r\n•支持WLAN、NFC、CMMB等特色业务；\r\n\r\n•支持中国移动各类型功能手机\r\n\r\n参数指标\r\n•BB+RF双芯片方案\r\n\r\n•TD-HSPA DL/UL:2.8/2.2Mbps,EDGE:Class 12\r\n\r\n•业内首款TD-HSPA/GSM+GSM双卡双待方案\r\n\r\n•WLAN、NFC、CMMB等特色业务Turnkey交付\r\n\r\n•55nm LP CMOS工艺\r\n\r\n•12mm x 12mm LFBGA封装;

Leadcore

联芯威电子