首页 >LAUNCHXL-CC2640R2>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
LAUNCHXL-CC2640R2 | TI LaunchPad??kit | TI1Texas Instruments 德州仪器 | TI1 | |
LAUNCHXL-CC2640R2 | 包装：散装 类别：开发板，套件，编程器 射频评估和开发套件，开发板 描述：CC2640R2F LAUNCHPAD DEV KIT | TI1Texas Instruments 德州仪器 | TI1 | |
CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州仪器 | TI1 | ||
CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器 | TI1 | ||
CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器 | TI1 | ||
CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3 | TI1Texas Instruments 德州仪器 | TI1 | ||
CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3 | TI1Texas Instruments 德州仪器 | TI1 | ||
CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州仪器 | TI1 | ||
CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod | TI1Texas Instruments 德州仪器 | TI1 | ||
CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 | TI |
产品属性
- 产品编号：
LAUNCHXL-CC2640R2
- 制造商：
Texas Instruments
- 类别：
开发板，套件，编程器 > 射频评估和开发套件，开发板
- 系列：
SimpleLink™
- 包装：
散装
- 类型：
收发器; Bluetooth® 5
- 频率：
2.4GHz
- 配套使用/相关产品：
CC2640R2F
- 所含物品：
板
- 描述：
CC2640R2F LAUNCHPAD DEV KIT
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
24+ |
SMD |
15600 |
射频开发工具 |
询价 | ||
TI/德州仪器 |
24+ |
48-VQFN |
15050 |
原厂支持公司优势现货 |
询价 | ||
TI |
20+ |
射频元件 |
155 |
就找我吧!--邀您体验愉快问购元件! |
询价 | ||
TI |
21+ |
开发板 |
10000 |
原装,品质保证,请来电咨询 |
询价 | ||
TI |
2021+ |
开发板 |
7600 |
原装现货，欢迎询价 |
询价 | ||
TI |
24+ |
开发板 |
30000 |
原装正品公司现货,假一赔十! |
询价 | ||
TI |
24+ |
开发板 |
6000 |
全新原装深圳仓库现货有单必成 |
询价 | ||
TI |
2022+ |
开发板 |
7600 |
原厂原装,假一罚十 |
询价 | ||
TI |
21+ |
开发板 |
10000 |
公司只做原装,诚信经营 |
询价 | ||
TI |
21+ |
开发板 |
10000 |
只做原装,质量保证 |
询价 |
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