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CC2640R2F

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.63739 Mbytes 页数:69 Pages

TI

德州仪器

CC2640R2F

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

文件:2.9638 Mbytes 页数:72 Pages

TI

德州仪器

CC2640R2F

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

文件:1.75855 Mbytes 页数:54 Pages

TI

德州仪器

CC2640R2F

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.65151 Mbytes 页数:72 Pages

TI

德州仪器

CC2640R2F

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

文件:2.21766 Mbytes 页数:63 Pages

TI

德州仪器

CC2640R2F

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.59194 Mbytes 页数:91 Pages

TI

德州仪器

CC2640R2F

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:2.60305 Mbytes 页数:59 Pages

TI

德州仪器

CC2640R2F

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:3.50774 Mbytes 页数:64 Pages

TI

德州仪器

CC2640R2F

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.42691 Mbytes 页数:75 Pages

TI

德州仪器

CC2640R2F

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.96385 Mbytes 页数:75 Pages

TI

德州仪器

技术参数

  • Features:

    LE 1M PHY

  • Type:

    Wireless MCU

  • RAM (KB):

    28

  • GPIO:

    10

  • Peripherals:

    1 UART

  • Security:

    Cryptographic acceleration

  • Sensitivity (best) (dBm):

    -97

  • Operating temperature range (C):

    -40 to 85

  • Rating:

    Catalog

供应商型号品牌批号封装库存备注价格
TI
24+
SO|16
70230
免费送样原盒原包现货一手渠道联系
询价
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
TI/德州仪器
24+
VQFN32
60000
询价
TI/德州仪器
24+
QFN
3557
现货热卖中
询价
TI
24+
VQFN
17900
一级授权代理原装现货热卖
询价
TI
23+
VQFN48
8600
受权代理!全新原装现货特价热卖!
询价
TI
25+23+
QFN
25549
绝对原装正品全新进口深圳现货
询价
TI
18+
QFN32
85600
保证进口原装可开17%增值税发票
询价
TI
三年内
QFN48
1983
只做原装正品
询价
TI/德州仪器
2020
VQFN32
3300
绝对全新原装现货,欢迎来电查询
询价
更多CC2640R2F供应商 更新时间2025-10-9 17:06:00