丝印：KJP；Package：SOT563；SURFACE MOUNT SWITCHING DIODE ARRAY

Features  Fast Switching Speed  Low Forward Voltage: Maximum of 0.715V at 1mA  Fast Reverse Recovery: Maximum of 4ns  Low Capacitance: Maximum of 1.5pF  Low Leakage Current  Ultra-Small Surface Mount Package  Thermally Efficient Copper Alloy Leadframe for High Power Dissipation  T

文件：598.89 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：KJP；Package：SOT563；SURFACE MOUNT SWITCHING DIODE ARRAY

Features  Fast Switching Speed  Low Forward Voltage: Maximum of 0.715V at 1mA  Fast Reverse Recovery: Maximum of 4ns  Low Capacitance: Maximum of 1.5pF  Low Leakage Current  Triple Isolated Fast Switching Diode Array  Ultra-Small Surface Mount Package  Thermally Efficient Copper Al

文件：585.29 Kbytes 页数：5 Pages

DIODES

美台半导体