丝印：KJ5；Package：SOT-23；SOT-23 Plastic-Encapsulate Diode

ZENER DIODE FEATURES： Planar Die Construction 350mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

文件：267.81 Kbytes 页数：3 Pages

SY

顺烨电子

丝印：KJ5；Package：SOT-23；Planar Die Construction

FEATURES • Planar Die construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：856.69 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：KJ5；Package：SOT-323；Planar Die Construction

FEATURES Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes

文件：853.63 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：KJ5；Package：SOT-363；Planar Die Construction

Features • Planar Die Construction • Dual Isolated Zeners in Ultra-Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Lead Free/RoHS Compliant (Note 5)

文件：856.07 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

A Historical Achievement of Technology Leadership

文件：2.87938 Mbytes 页数：36 Pages

ITT