ST传感器代理LSM6DS3TR
深圳世联芯科技专业代理ST 传感器陀螺仪LSm6DS3TR LSm6DS33TR LIS3DH
深圳市世联芯科技 联系电话 13828760986 赵工
LSM6DS3TR原理图 样品申请咨询QQ 2677332671
LSM6DS3TR 具有业界最低功耗的6轴陀螺仪芯片
目前已经在OPPO的智能手机上得到广泛应用
The 低功耗 LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.
Key Features
Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
“Always-on” experience with low power consumption for both accelerometer and gyroscope
Smart FIFO up to 8 kbyte based on features set
Compliant with Android K and L
Hard, soft ironing for external magnetic sensor corrections
±2/±4/±8/±16 g full scale
±125/±245/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I2 C serial interface with main processor data synchronization feature
Embedded temperature sensor
ECOPACK® , RoHS and “Green” compliant
DESIGN
Technical Documentation
Product Specifications
Description Version Size
DS10591 DS10591: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 8.0 1 MB
Application Notes
Description Version Size
AN4650 AN4650: LSM6DS3: always-on 3D accelerometer and 3D gyroscope 3.0 1 MB
Technical Notes & Articles
Description Version Size
TN0018 TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
LSM6DS3 将会是一个最佳化的系统级封装双芯片双芯片解决方案，整合高性能 3 轴数码加速度计和 3 轴数码陀螺仪，提供高能效工作模式，在始终开启模式下，功耗最低至 0.6mA。新双芯片解决方案双芯片整合了始终开启低功耗功能和优异的感测精准度，超低的杂讯确保动作侦测和分析功能达到业界最高水准。
LSM6DS3 事件侦测中断功能可实现高效可靠的硬件动作追踪和环境感测功能，让设备能够侦测自由落体、6D 方向、敲击／双击（tap and double-tap）感测、活动或非活动和唤醒事件。凭藉意法半导体在支持主流操作系统方面积累的厚实经验，LSM6DS3 将能够有效地处理现实、虚拟和批模式（batch-mode）感测器数据，进而节省电能及加快系统反应。事实上，新产品在设计上透过硬件实现有效动作、倾斜度、计步器功能和时间标记（Time Stamp），可支持软硬件修正外部磁力计数据采集。
最后，LSM6DS3 将为开发人员提供充足的硬件灵活性，透过不同的连接方式将针脚连至外部感测器，执行感测器集线器（sensor hub）、辅助 SPI（序列周边界面）附加功能以及其它的重要功能。
