AP6210代理 价格 咨询电话 13828760986
深圳市世联芯科技有限公司
专业代理AMPAK正基WIFI模块
AP6210
AP6181
AP6234
AP6330
AP6335
WSDB-751GN
Established in 2000, AMPAK Technology is the most dedicated optical communication and wireless multimedia company. AMPAK Technology has professional managers, experienced marketing and sales staffs, research and development experts as well as dedicated engineers and technicians. Embracing the core concept of customer satisfaction, we provide excellent products and services to our customers. Our company goals are to share the benefits and profits among customers, shareholders, and employees. In order to offer total solution services to our customers, AMPAK Technology establishes three business units: Wireless Multi-media, Optical Communication, and Mechanical Component. Wireless Multi-media business unit is one of the leading business sectors in RF, logical circuit designing, packaging, and testing in Taiwan. The business unit provides wireless multimedia products such as SiP (Systems in Package) and Wireless HDMI. SiP products integrate either Wi-Fi, Bluetooth, FM, or GPS systems into small size modules. Therefore, the modules can meet the specification requirement of handheld products which are in a compact trend. As for Wireless HDMI product, it transmits image and voice signals from devices (ex. from DVD player) to digital television sets or monitors wirelessly. This advanced transmission technology will replace the traditional way of transmission via cables.
Optical Communication business unit devoted to provide the Tocan packaging and testing services for optoelectronics components. We have recruited the professional team members in this field with the best machines and devices in the world plus unique tooling that developed in house. we are capable of providing very high precise packaging and testing services in volumes. We don’t just package and testing TO products, we provide the total solution for optoelectronics industry. Mechanical Component business unit provides mechanical components for our customers. The production base is located in KunShan, China to get closer to customers for better services as well as to provide cost-competitive products.
正基的WIFI 蓝牙模块型号
Wireless SiP GB9619 GB9619 more Wireless Compatity : WLAN 802.11 b/g/n(1x1) Size (mm) : 9.0x9.0x1.4 Host Interface : SDIO/SPI Clock Source : No external clock needed Voltage : 3.3V Type : Shielding module GB8632 GB8632 more Wireless Compatity : WLAN 802.11 b/g/n(1x1) + Bluetooth 2.1 + EDR Size (mm) : 10.0x10.0x1.4 Host Interface : WiFi: SDIO BT: UART Clock Source : No external clock needed Voltage : 3.3V Type : Shielding module GB6658 GB6658 more Wireless Compatity : WLAN 802.11b/g/n(1x1) + Bluetooth 2.1 + EDR Size (mm) : 9.0x7.8x1.25 Host Interface : WiFi: SDIO BT: UART Clock source : External clock needed Voltage Supply : 3.3V Type : Molding module GB86302F GB86302F more Wireless Compatity : 802.11 b/g/n + Bluetooth 4.0 + FM Tx/Rx Size (mm) : 10.0 x 10.0 x 1.3 mm Host Interface : SDIO (4bit/1bit) / gSPI / HSIC GB86302X GB86302X more Wireless Compatity : 802.11 a/b/g/n + Bluetooth 4.0 + FM Tx/Rx Size (mm) : 10.0 x 10.0 x 1.3 mm Host Interface : SDIO (4bit/1bit) / gSPI / HSIC GB96362G GB96362G more Wireless Compatity : IEEE 802.11g/b/n 1x1 Size (mm) : 10.0 x 10.0 x 1.3 mm Host Interface : SDIOV2.0 (4bit/1bit) / gSPI GT86722B GT86722B more Wireless Compatity : 802.11 b/g/n + Bluetooth 2.1 + FM Tx/Rx Size (mm) : 10.0 x 10.0 x 1.5 mm Host Interface : GT9660F1 GT9660F1 more Wireless Compatity : Bluetooth 2.1 + EDR Size (mm) : 7.0 x 7.0 x 1.5 mm Host Interface : WSDB-607GN WSDB-607GN more Wireless Compatity : IEEE 802.11g/b/n 1x1 Size (mm) : 40.0 x 20.0 x 3.0 mm
