HMC709LC5RF/IF射频/中频RFID的RFIC模块规格书PDF中文资料

HMC709LC5属于RF/IF射频/中频RFID的RFIC模块。由亚德诺半导体技术有限公司制造生产的HMC709LC5RF 其它 IC 和模块RF 其它 IC 和模块产品系列包含各种独特、专门或特定用途的产品，可与 RF、IF 和微波无线电应用结合使用。示例包括 AM/FM 调谐器和接收器、偏置网络、基带处理器、计数器、数字可调电容器、下变频器、倍频器、移相器、前置分频器、端接器、上变频器、VCO 等。

General Description

The HMC709LC5 is a compact GaAs MMIC I/Q upconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 13 dB with -20 dBc of sideband rejection. The HMC709LC5 utilizes a driver amplifier preceded by an I/Q mixer which is driven by an LO buffer amplifier. IF1 and IF2 mixer inputs are provided and an external 90° hybrid is needed to select the required sideband. The I/Q mixer topology reduces the need for filtering of the unwanted sideband. The HMC709LC5 is a much smaller alternative to hybrid style single sideband upconverter assemblies and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.

特性 Features

High Conversion Gain: 13 dB

Sideband Rejection: -20 dBc

LO to RF Isolation: 10 dB

Output IP3: +26 dBm

32 Lead 5x5mm SMT Package: 25mm²

Typical Applications

The HMC709LC5 is ideal for:

• Point-to-Point and Point-to-Multi-Point Radio

• Military Radar, EW & ELINT

• Ku Band VSAT Upconverters

• Sensors

• Test & Measurement Equipment