RoHS Compliant 3x3 mm SMT Package

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15 d

文件：365.13 Kbytes 页数：6 Pages

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SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15 d

文件：353.16 Kbytes 页数：6 Pages

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SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15

文件：252.37 Kbytes 页数：6 Pages

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x2有源倍频器SMT，8 - 21 GHz Fout

HMC561LP3(E)是一款使用GaAs PHEMT技术的x2有源宽带倍频器，采用符合RoHS标准的无引脚SMT封装。 由+5 dBm信号驱动时，该倍频器在8至21 GHz范围内提供+14 dBm的典型输出功率，在16 GHz频率下，Fo和3Fo隔离均为15 dBc。 HMC561LP3(E)非常适合在点对点和VSAT无线电的LO倍频链中使用，与传统方法相比，可以减少器件数量。 \n\n100 kHz偏置时的低加性SSB相位噪声为-139 dBc/Hz，有助于保持良好的系统噪声性能。 HMC561LP3(E)采用符合RoHS标准的封装，无需线焊，可以使用表贴制造技术。 • 高输出功率： +14 dBm \n\n• 低输入功耗驱动： 0至+6 dBm \n\n• Fo隔离： 15 dBc (Fout = 16 GHz);

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Package：16-VFQFN 裸露焊盘；包装：带 功能：频率系数 类别：RF/IF，射频/中频和 RFID RF 其它 IC 和模块 描述：IC MULTIPLIER X2 BB FREQ 16-QFN

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SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15

文件：252.37 Kbytes 页数：6 Pages

HITTITE

RoHS Compliant 3x3 mm SMT Package

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15 d

文件：365.13 Kbytes 页数：6 Pages

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亚德诺

SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15

文件：252.37 Kbytes 页数：6 Pages

HITTITE

SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

General Description The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15 d

文件：353.16 Kbytes 页数：6 Pages

HITTITE

Package：16-VFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 功能：频率系数 类别：RF/IF，射频/中频和 RFID RF 其它 IC 和模块 描述：IC MULTIPLIER X2 BB FREQ 16-QFN

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