丝印：HCT574EP；Package：SOIC；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：SOIC；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：TSSOP；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：TSSOP；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：SOIC；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：TSSOP；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：SOIC；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器

丝印：HCT574EP；Package：TSSOP；HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE, POSITIVE-EDGE TRIGGERED

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Buffered Inputs Common 3-State Output-Enable Control

文件：688.84 Kbytes 页数：17 Pages

TI

德州仪器