DVB-S2+H.264 HD，BGA高安,Ethernet

NationalChip

国芯微电子

PHOTOMULTIPLIER TUBE ASSEMBLIES

文件：26.95 Kbytes 页数：2 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

滨松光子滨松光子学株式会社

Support smart interface chip of QC3.0/Apple mobile phone/Samsung mobile phone

文件：1.43686 Mbytes 页数：13 Pages

HMSEMI

华之美半导体

HEXFET Power MOSFET Silicon Technology with the advanced DirectFETTM

Description The IRF6610 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

文件：243.15 Kbytes 页数：9 Pages

IRF