丝印：GC9；Package：DSBGA；LM4931 Boomer™ Audio Power Amplifier Series Audio Subsystem with Mono High Efficiency Loudspeaker and Stereo Headphone Amplifiers

1FEATURES 23• 18-bit 44.1kHz or 48kHz Stereo DAC • 16-bit 8kHz , 12kHz , 16kHz, or 24kHz Voice- Band Codec • PLL for Operation from Common System Clocks • Either I2C or SPI Compatible Serial Interface • I2S Digital Audio Data Serial Interface • PCM Voice Audio Data Serial Interface • Diff

文件：902.91 Kbytes 页数：50 Pages

TI

德州仪器

丝印：GC9；Package：DSBGA；LM4931 Boomer™ Audio Power Amplifier Series Audio Subsystem with Mono High Efficiency Loudspeaker and Stereo Headphone Amplifiers

1FEATURES 23• 18-bit 44.1kHz or 48kHz Stereo DAC • 16-bit 8kHz , 12kHz , 16kHz, or 24kHz Voice- Band Codec • PLL for Operation from Common System Clocks • Either I2C or SPI Compatible Serial Interface • I2S Digital Audio Data Serial Interface • PCM Voice Audio Data Serial Interface • Diff

文件：902.91 Kbytes 页数：50 Pages

TI

德州仪器

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美

PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

文件：113.16 Kbytes 页数：2 Pages

Microsemi

美高森美