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STGB30H60DLFB

丝印:GB30H60DLFB;Package:D2PAK;Trench gate field-stop IGBT, HB series 600 V, 30 A high speed

Description These devices are IGBTs developed using an advanced proprietary trench gate and field stop structure. The device is part of the new HB series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of any frequency conve

文件:1.74476 Mbytes 页数:20 Pages

STMICROELECTRONICS

意法半导体

供应商型号品牌批号封装库存备注价格
ST(意法半导体)
24+
TO-263-3
1612
原厂订货渠道,支持BOM配单一站式服务
询价
STM
1809+
TO-263
1675
就找我吧!--邀您体验愉快问购元件!
询价
22+
NA
3000
加我QQ或微信咨询更多详细信息,
询价
ST
22+
D2PAK
9000
原厂渠道,现货配单
询价
ST/意法
23+
TO-263
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
ST/意法
22+
N
30000
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
询价
STMicroelectronics
2022+
D2PAK
38550
全新原装 支持表配单 中国著名电子元器件独立分销
询价
ST
2405+
原厂封装
50000
15年芯片行业经验/只供原装正品:0755-83268824邹小姐
询价
ST
23+
D2PAK
8000
只做原装现货
询价
24+
N/A
48000
一级代理-主营优势-实惠价格-不悔选择
询价
更多GB30H60DLFB供应商 更新时间2025-9-21 8:11:00