丝印：G5；Voltage Regulator Diodes

Features ◇ Sillicon planar zener diodes. ◇ Low profile surface-mount package. ◇ Zener and surge current specification ◇ Low leakage current ◇ Excellent stability ◇ High temperature soldering guaranteed: 265℃/10 seconds, at terminals

文件：2.05751 Mbytes 页数：4 Pages

LUGUANG

鲁光电子

丝印：G5；Package：SOD-123FL；Voltage Regulator Diodes

Features ◇ Sillicon planar zener diodes. ◇ Low profile surface-mount package. ◇ Zener and surge current specification ◇ Low leakage current ◇ Excellent stability ◇ High temperature soldering guaranteed: 265℃/10 seconds, at terminals

文件：742.14 Kbytes 页数：4 Pages

LUGUANG

鲁光电子

丝印：G5；Package：SOD123F；Voltage regulator diodes

1. General description General-purpose Zener diodes in an SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Total power dissipation: ≤ 830 mW • Three tolerance series: ±1 %, ±2 % and approximately ±5 % • Wide working voltage ra

文件：333.71 Kbytes 页数：14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：G5；Package：SOD123F；Voltage regulator diodes

1. General description General-purpose Zener diodes in an SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Total power dissipation: ≤ 830 mW • Three tolerance series: ±1 %, ±2 % and approximately ±5 % • Wide working voltage ra

文件：314.74 Kbytes 页数：14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：G5；Package：SOD-323；SURFACE MOUNT ZENER DIODES

FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：965.46 Kbytes 页数：5 Pages

SY

顺烨电子

丝印：G5；Package：SOD-123；ZENER DIODES

Planar Die Construction 500mW Power Dissipation 2.4V- 75V Standoff Voltage 5% Nominal Zener Voltage Designed for Surface Mount Application Plastic Material-UL Recognition Flammability Classification 94V-O This is a Halogen Free Device All SMC parts are traceable to the wafer lot Addit

文件：323.18 Kbytes 页数：5 Pages

SMCDIODE

桑德斯微电子

丝印：G5；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction Ultra-Small Surface Mount Package General purpose, Medium Current 350mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes

文件：2.90923 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：G5；Package：SOD-323；SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction Ultra-Small Surface Mount Package 350mW Power Dissipation On Ceramic PBC General purpose, Medium Current Ideally Suited for Automated Assembly Processes

文件：3.05886 Mbytes 页数：7 Pages

UNSEMI

优恩半导体

丝印：G5；Package：MicroPak2；TinyLogic ULP-A Buffer with Schmitt-Trigger Input

The NC7SV17 is a single buffer with Schmitt−Trigger Input in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. Features • Designed for 0.9 V to 3.6 V VCC Operation • 2.0 ns tPD at 3.3 V (Typ) • Inputs/Outputs Over−Voltage Tolerant up to 3.6 V • IOFF Suppo

文件：388.48 Kbytes 页数：11 Pages

ONSEMI

安森美半导体

丝印：G5；Package：MicroPak；TinyLogic ULP-A Buffer with Schmitt-Trigger Input

The NC7SV17 is a single buffer with Schmitt−Trigger Input in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. Features • Designed for 0.9 V to 3.6 V VCC Operation • 2.0 ns tPD at 3.3 V (Typ) • Inputs/Outputs Over−Voltage Tolerant up to 3.6 V • IOFF Suppo

文件：388.48 Kbytes 页数：11 Pages

ONSEMI

安森美半导体