General Description

The FSB50760BSF / FSB50760BSFS is an advanced Motion

SPM 5 module providing a fully−featured, high−performance inverter

output stage for AC Induction, BLDC and PMSM motors such as

refrigerators, fans and pumps. These modules integrate optimized gate

drive of the built−in MOSFETs (SuperFET technology) to minimize

EMI and losses, while also providing multiple on−module protection

features including under−voltage lockouts and thermal monitoring.

The built−in high−speed HVIC requires only a single supply voltage

and translates the incoming logic−level gate inputs to the

high−voltage, high−current drive signals required to properly drive the

module’s internal MOSFETs. Separate open−source MOSFET

terminals are available for each phase to support the widest variety of

control algorithms.

Features

• UL Certified No. E209204 (UL1557)

• 600 V RDS(ON) = 830 m (Max) SuperFET MOSFET 3−Phase

Inverter with Gate Drivers and Protection

• Built−In Bootstrap Diodes Simplify PCB Layout

• Separate Open−Source Pins from Low−Side MOSFETs for

Three−Phase Current−Sensing

• Active−HIGH Interface, Works with 3.3 / 5 V Logic, Schmitt−trigger

Input

• Optimized for Low Electromagnetic Interference

• HVIC Temperature−Sensing Built−In for Temperature Monitoring

• HVIC for Gate Driving and Under−Voltage Protection

• Isolation Rating: 1500 Vrms / min.

• Moisture Senstive Level (MSL) 3

• These Devices are Pb−Free and are RoHS Compliant

Applications

• 3−Phase Inverter Driver for Small Power AC Motor Drives

FSB50760BSF属于分立半导体产品 > 功率驱动器模块。安森美半导体公司制造生产的FSB50760BSF功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。