FF900R12IE4VP数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

PrimePACK™ 2 1200 V, 900 A half-bridge dual IGBT module especially developed for CAV applications. Including TRENCHSTOP™ IGBT4, Emitter Controlled 4 Diode, NTC, fast switching chip and pre-applied Thermal Interface Material.

特性 Features

• Vibration robustness up to 15g
• Extended operation temperature Tvj op
• High DC stability
• High short circuit capability, self limiting short circuit current
• Low switching losses
• VCEsatwith positive temperature coefficient
• 4 kV AC 1 min insulation
• Package with CTI > 400
• High creepage and clearance distances
• High power and thermal cycling capability
• Substrate for low thermal resistance
• UL recognized

优势:
• Increased load cycle capability
• Robust against hazardous conditions
• High ruggedness against vibrations and shock
• Electric drives outperform hydraulics
 

简介

FF900R12IE4VP属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FF900R12IE4VP晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。