FF650R17IE4D_B2数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

PrimePACK™ 2 1700 V, 650 A half-bridge dual IGBT module especially developed for Traction applications. Including TRENCHSTOP™ IGBT4, NTC and fast switching chip. Also available with Thermal Interface Material.

特性 Features

• Extended operation temperature Tvj op
• High DC stability
• High current density
• Low switching losses
• Tvj op= 150°C
• Enlarged diode for regenerative operation
• Low VCEsat
• Package with CTI > 400
• High creepage and clearance distances
• High power and thermal cycling capability
• Copper base plate
• UL recognized

优势:
• High power density
• Standardized housing

简介

FF650R17IE4D_B2属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FF650R17IE4D_B2晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。