FF75R12YT3数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

EasyDUAL™ 2 1200V dual IGBT module with IGBT3

特性 Features

·High power density
·Established Easy module concept
·Integrated temperature sensor available
·Low stray inductance module design
·RoHS-compliant modules

应用 Application

  Please also find our EiceDRIVER™ HV Gate Driver portfolio. Including EiceDRIVER™ Compact Driver ICs for your easy and reliable design. Especially the 1EDI60I12AF suitable for IGBT module solution. (Evalboard available)Please find further information about Boost and Inverter IGBT-modules especially designed for Solar String and Multi-String Inverters.Optimize your application with an EiceDRIVER™ Enhanced HV Gate Driver IC. FF75R12YT3Data Sheet (714 KB, EN/CN)EN/DEEN/JAParametricFF75R12YT3Configuration DualIC(nom) / IF(nom)  75.0A VCE(sat)(Tvj=25°C typ) 1.8V VF(Tvj=25°C typ) 1.75V Housing EasyDUAL™ 2Dimensions(width) 45.6mm Dimensions(length) 55.9mm Data SheetTitleSizeDateVersionFF75R12YT3 (chinese/english)EN/CNEN/DEEN/JA714 KB09 十二月 201302_00Product BrochureTitleSizeDateVersion1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionSoldering of Econo and Easy ModulesEN194 KB10 二月 2014Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00Mounting Instructions EasyPIM™and EasyPACK modules with screw clampsEN408 KB10 二月 2014电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009E3和T3系列1200V IGBT3 模块的性能差异CNEN330 KB25 十一月 2013等效热路模型CNEN500 KB25 十一月 2013如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionEasy & Econo Power ModulesEN433 KB27 四月 201608_00EditorialsTitleSizeDateVersionThermal Heat Sink Interface of IGBT Modules w/o Base PlateEN384 KB07 二月 2014Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00Material Content Data SheetTitleSizeDateVersionMCDS - Easy2EN37 KB06 一月 201403_00销售产品名称FF75R12YT3OPNFF75R12YT3BOMA1产品状态not for new design在线订购封装名称AG-EASY2-1无铅产品no无卤no通过无铅认证yes包装规格20包装类型TRAY评估板评估板系列描述状态2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.·For equipping EiceDRIVER™ 2ED300C17-S / -ST

简介

FF75R12YT3属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FF75R12YT3晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。