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EP3CLS70集成电路(IC)的FPGA(现场可编程门阵列)规格书PDF中文资料

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厂商型号

EP3CLS70

参数属性

EP3CLS70 封装/外壳为484-BGA;包装为托盘;类别为集成电路(IC)的FPGA(现场可编程门阵列);产品描述:IC FPGA 278 I/O 484FBGA

功能描述

Cyclone III Device Handbook

封装外壳

484-BGA

文件大小

7.30201 Mbytes

页面数量

274

生产厂商

Altera

中文名称

阿尔特

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-10-8 11:19:00

人工找货

EP3CLS70价格和库存,欢迎联系客服免费人工找货

EP3CLS70规格书详情

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■ “Cyclone III Device Family Features” on page 1–1

■ “Cyclone III Device Family Architecture” on page 1–6

■ “Reference and Ordering Information” on page 1–12

产品属性

  • 产品编号:

    EP3CLS70F484C7N

  • 制造商:

    Intel

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Cyclone® III

  • 包装:

    托盘

  • 电压 - 供电:

    1.15V ~ 1.25V

  • 安装类型:

    表面贴装型

  • 工作温度:

    0°C ~ 85°C(TJ)

  • 封装/外壳:

    484-BGA

  • 供应商器件封装:

    484-FBGA(23x23)

  • 描述:

    IC FPGA 278 I/O 484FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
ALTERA
25+
BGA
6500
独立分销商 公司只做原装 诚心经营 免费试样正品保证
询价
ALTERA
20+
NA
33560
原装优势主营型号-可开原型号增税票
询价
ALTERA/阿尔特拉
23+
BGA484
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
24+
N/A
60000
一级代理-主营优势-实惠价格-不悔选择
询价
Altera
23+
BGA
26800
正规渠道,只有原装!
询价
ON/安森美
23+
DIP
69820
终端可以免费供样,支持BOM配单!
询价
ALTERA/阿尔特拉
23+
NA
1218
原装正品代理渠道价格优势
询价
INTEL(英特尔)
2447
FBGA-780(29x29)
31500
4个/托盘一级代理专营品牌!原装正品,优势现货,长期
询价
ACBEL
MODULE
8899
只做进口原装!假一罚十!绝对有货!
询价
Intel FPGAs/Altera
23+
484-UBGA19x19
7300
专注配单,只做原装进口现货
询价