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EP3CLS200中文资料PDF规格书

EP3CLS200
厂商型号

EP3CLS200

参数属性

EP3CLS200 封装/外壳为484-BGA;包装为托盘;类别为集成电路(IC) > FPGA(现场可编程门阵列);产品描述:IC FPGA 210 I/O 484FBGA

功能描述

1. Cyclone III Device Family Overview

文件大小

395.27 Kbytes

页面数量

14

生产厂商 Altera Corporation
企业简称

Altera阿尔特

中文名称

阿尔特拉公司官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-6-22 23:00:00

EP3CLS200规格书详情

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■ “Cyclone III Device Family Features” on page 1–1

■ “Cyclone III Device Family Architecture” on page 1–6

■ “Reference and Ordering Information” on page 1–12

产品属性

  • 产品编号:

    EP3CLS200F484C7N

  • 制造商:

    Intel

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Cyclone® III

  • 包装:

    托盘

  • 电压 - 供电:

    1.15V ~ 1.25V

  • 安装类型:

    表面贴装型

  • 工作温度:

    0°C ~ 85°C(TJ)

  • 封装/外壳:

    484-BGA

  • 供应商器件封装:

    484-FBGA(23x23)

  • 描述:

    IC FPGA 210 I/O 484FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
Intel/Altera
23+
BGA780
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
ALTERA/阿尔特拉
23+
NA/
35
优势代理渠道,原装正品,可全系列订货开增值税票
询价
ALTERA
2016+
BGA
3000
公司只做原装,假一赔十,可开17%增值税发票!
询价
Holt
三年内
1983
纳立只做原装正品13590203865
询价
ALTERA
1844+
BGA
6528
只做原装正品假一赔十为客户做到零风险!!
询价
ALTERA
22+
BGA
58000
原装现货,OEM渠道。
询价
ALTERA
1419+
BGA
21
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
ALTERA
23+
BGAQFP
8659
原装公司现货!原装正品价格优势.
询价
INTEL(英特尔)
2021+
FBGA-484(23x23)
499
询价
ALTERA/阿尔特拉
ALTERA
68900
原包原标签100%进口原装常备现货!
询价