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EP3CLS150中文资料PDF规格书

EP3CLS150
厂商型号

EP3CLS150

参数属性

EP3CLS150 封装/外壳为780-BGA;包装为托盘;类别为集成电路(IC) > FPGA(现场可编程门阵列);产品描述:IC FPGA 413 I/O 780FBGA

功能描述

Cyclone III Device Handbook

文件大小

7.30201 Mbytes

页面数量

274

生产厂商 Altera Corporation
企业简称

Altera阿尔特

中文名称

阿尔特拉公司官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-6-22 23:00:00

EP3CLS150规格书详情

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■ “Cyclone III Device Family Features” on page 1–1

■ “Cyclone III Device Family Architecture” on page 1–6

■ “Reference and Ordering Information” on page 1–12

产品属性

  • 产品编号:

    EP3CLS150F780I7

  • 制造商:

    Intel

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Cyclone® III

  • 包装:

    托盘

  • 电压 - 供电:

    1.15V ~ 1.25V

  • 安装类型:

    表面贴装型

  • 工作温度:

    -40°C ~ 100°C(TJ)

  • 封装/外壳:

    780-BGA

  • 供应商器件封装:

    780-FBGA(29x29)

  • 描述:

    IC FPGA 413 I/O 780FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
Intel/Altera
23+
BGA780
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
Intel/Altera
23+
BGA-780
4
优势代理渠道,原装正品,可全系列订货开增值税票
询价
ALTERA/阿尔特拉
23+
FBGA-780
2868
原厂原装正品现货,代理渠道,支持订货!!!
询价
ALTERA
2010+
N/A
74
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
ALTERA/阿尔特拉
22+
484-FBGA(23x23)
5500
阿尔特拉国外优势渠道,支持终端生产
询价
ALTERA
23+
BGAQFP
8659
原装公司现货!原装正品价格优势.
询价
INTEL(英特尔)
2021+
FBGA-484(23x23)
499
询价
ALTERA/阿尔特拉
BGAQFP
68900
原包原标签100%进口原装常备现货!
询价
Altera
21+
BGA
26800
只做原装,质量保证
询价
ALTERA
21+
BGA
35200
一级代理/放心采购
询价