EMIF03-SIM02F1中文资料意法半导体数据手册PDF规格书

描述 Description

The EMIF03-SIM02F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.The EMIF03 Flip Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15kV.

特性 Features

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Lead-free package

■ Very low PCB space consuming: 1.42 mm x 1.42 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through integration and wafer level packaging

Applications

EMI filtering and ESD protection for:

■ SIM Interface (Subscriber Identify Module)

■ UIM Interface (Universal Identify Module)