EMIF02-SPK03F1中文资料意法半导体数据手册PDF规格书

DESCRIPTION

The EMIF02-SPK01 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

MAIN PRODUCT CHARACTERISTICS:

Where EMI filtering in ESD sensitive equipment is required :

■ Mobile phones and communication systems

■ Computers, printers and MCU Boards

BENEFITS

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Very low PCB space consuming: 1.07 mm x 1.47 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reducing of parasitic elements through inte gration & wafer level packaging