EMIF02-MIC03F3中文资料意法半导体数据手册PDF规格书

DESCRIPTION

The EMIF02-MIC02 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 flip chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV.

BENEFITS

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Lead free package

■ Very low PCB space consuming: 1.07mm x 1.57mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reducing of parasitic elements through integration & wafer level packaging.

MAIN PRODUCT CHARACTERISTICS:

Where EMI filtering in ESD sensitive equipment is required:

■ Mobile phones and communication systems

■ Computers, printers and MCU Boards