EMIF02-XZZFF中文资料意法半导体数据手册PDF规格书

DESCRIPTION

The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (On The Go).

The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.

Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV on external contacts.

BENEFITS

■ 2 lines low-pass-filter + 2 lines ESD protection

■ High efficiency in EMI filtering

■ Lead Free package

■ Very low PCB space consuming: < 3.25 mm2

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression (IEC61000-4-2 level 4)

■ High reliability offered by monolithic integration

■ High reducing of parasitic elements through

■ integration and wafer level packaging.

PRODUCT CHARACTERISTICS

ESD protection and EMI filtering for:

■ USB OTG port