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HSB276AYP

SILICONSCHOTTKYBARRIERDIODEFORHIGHSPEEDSWITCHING

Features •Highforwardcurrent,Lowcapacitance. •CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276AYP

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

Features •Highforwardcurrent,Lowcapacitance. •CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSB276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276S

SiliconSchottkyBarrierDiodeforDetectorandMixer

Features •Highforwardcurrent,Lowcapacitance. •HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSB276S

SiliconSchottkyBarrierDiode

Features ●Highforwardcurrent,Lowcapacitance. ●HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ●CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信电子广东科信实业有限公司

HSC276

SiliconSchottkyBarrierDiodeforMixer

Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

HitachiHitachi Semiconductor

日立日立公司

HSC276

HSC276_03

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSC276

SiliconSchottkyBarrierDiode

Features ●Highforwardcurrent,Lowcapacitance. ●UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信电子广东科信实业有限公司

HSC276A

SiliconSchottkyBarrierDiodeforMixer

Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

HitachiHitachi Semiconductor

日立日立公司

HSC276A

SiliconSchottkyBarrierDiodeforMixer

Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

详细参数

  • 型号:

    EGD276G

  • 制造商:

    COOPER B-LINE

  • 功能描述:

    CABINET DOOR GLASS 27U 600MM

供应商型号品牌批号封装库存备注价格
24+
N/A
64000
一级代理-主营优势-实惠价格-不悔选择
询价
AISHI
22+
N/A
2500
进口原装,优势现货
询价
AISHI
2
询价
AISHI
24+
con
10000
查现货到京北通宇商城
询价
AISHI
24+
con
5000
优势库存,原装正品
询价
更多EGD276G供应商 更新时间2025-5-25 11:06:00