首页 >DS276S-T>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
TwophasebrushlessfanHalldrivingchip | EGMICROJingjing Microelectronics Co., Ltd 屹晶微电子屹晶微电子有限公司 | EGMICRO | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 远翔科技远翔科技股份有限公司 | FEELING | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 远翔科技远翔科技股份有限公司 | FEELING | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 远翔科技远翔科技股份有限公司 | FEELING | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 远翔科技远翔科技股份有限公司 | FEELING | ||
N-ChannelPowerMOSFET | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
ComplementaryOutputHallEffectLatchedSinkDriverIC | GTMGTM CORPORATION 勤益投资控股勤益投资控股股份有限公司 | GTM | ||
ComplementaryOutputHallEffectLatchedSinkDriverIC | ETLE-Tech Electronics LTD 亚历电子亚历电子有限公司 | ETL | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
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