首页 >DP0245C>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -AEC-Q101Qualified&PPAP. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Termi | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. - | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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