首页 >D75237GJ>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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1.85by1.85mm(.073by.073??PitchGbX*BackplaneConnectorSystemin2,3,4and5-PairColumns | MolexMolex Incorporated 莫仕 | Molex | ||
MOSINTEGRATEDCIRCUIT FEATURES lBuilt-in,large-capacityROMandRAM •Programmemory(ROM):24K´8 •Datamemory(RAM):1K´4 lI/Oport:64ports(exceptFIPdedicatedpins) lMinimuminstructionexecutiontime:0.67ms(when operatedat6.0MHz) lInstructionexecutiontimevaryingfunctiontoachieve aw | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
4-BITSINGLE-CHIPMICROCOMPUTER SEMICONDUCTORSELECTIONGUIDE Microcomputer ICMemory Semi-CustomIC ParticularPurposeIC GeneralPurposeLinearIC Transistor/Diode/Thyristor MicrowaveDevice/ConsumerUseHighFrequencyDevice OpticalDevice Packages Index(QuickReferencebyTypeN | NECRenesas Electronics America 瑞萨日本瑞萨电子株式会社 | NEC | ||
4-BITSINGLE-CHIPMICROCOMPUTER SEMICONDUCTORSELECTIONGUIDE Microcomputer ICMemory Semi-CustomIC ParticularPurposeIC GeneralPurposeLinearIC Transistor/Diode/Thyristor MicrowaveDevice/ConsumerUseHighFrequencyDevice OpticalDevice Packages Index(QuickReferencebyTypeN | NECRenesas Electronics America 瑞萨日本瑞萨电子株式会社 | NEC |
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