首页 >CTES0336V-G>规格书列表
零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
---|---|---|---|---|
DLVSeriesLowVoltageDigitalPressureSensors | ASC All Sensors | ASC | ||
3GbpsHD/SDSDILowPowerReclocker | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 | ||
Common-DrainN-ChannelTrenchMOSFET30V,9A,9.5m(ohm) | MGCHIP MagnaChip Semiconductor. | MGCHIP | ||
Common-DrainN-ChannelTrenchMOSFET30V,9A,9.5m(ohm) | MGCHIP MagnaChip Semiconductor. | MGCHIP | ||
CascadableSiliconBipolarMMICAmplifier | BOARDCOMBroadcom Corporation. 博通公司博通半导体 | BOARDCOM | ||
CostEffectiveCeramicMicrostripPackage Description TheMSA-0336isahighperformancesiliconbipolarMonolithicMicrowaveIntegratedCircuit(MMIC)housedinacosteffective,microstrippackage.ThisMMICisdesignedforuseasageneralpurpose50Ωgainblock.TypicalapplicationsincludenarrowandbroadbandIFandRFamplifiers | AVAGOAVAGO TECHNOLOGIES LIMITED 安华高 | AVAGO | ||
CascadableSiliconBipolarMMICAmplifiers Description TheMSA-0335isahighperformancesiliconbipolarMonolithicMicrowaveIntegratedCircuit(MMIC)housedinacosteffective,microstrippackage.ThisMMICisdesignedforuseasageneralpurpose50Ωgainblock.TypicalapplicationsincludenarrowandbroadbandIFandRFamplifiers | HPAgilent(Hewlett-Packard) 安捷伦科技安捷伦科技有限公司 | HP | ||
CascadableSiliconBipolarMMICAmplifiers Description TheMSA-0335isahighperformancesiliconbipolarMonolithicMicrowaveIntegratedCircuit(MMIC)housedinacosteffective,microstrippackage.ThisMMICisdesignedforuseasageneralpurpose50Ωgainblock.TypicalapplicationsincludenarrowandbroadbandIFandRFamplifiers | HPAgilent(Hewlett-Packard) 安捷伦科技安捷伦科技有限公司 | HP | ||
CascadableSiliconBipolarMMICAmplifier | BOARDCOMBroadcom Corporation. 博通公司博通半导体 | BOARDCOM | ||
CostEffectiveCeramicMicrostripPackage Description TheMSA-0336isahighperformancesiliconbipolarMonolithicMicrowaveIntegratedCircuit(MMIC)housedinacosteffective,microstrippackage.ThisMMICisdesignedforuseasageneralpurpose50Ωgainblock.TypicalapplicationsincludenarrowandbroadbandIFandRFamplifiers | AVAGOAVAGO TECHNOLOGIES LIMITED 安华高 | AVAGO |
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|