首页 >CS0402-3N9G-S>规格书列表
零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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WirewoundSurfaceMountInductors | API API Delevan | API | ||
AutomotiveMultilayerCeramicChipInductor Features •PPAPreadyandsupported •TS16949certifiedproductionlines •AEC-Q200(grade1)qualified •CeramicbasewithhighSRF •ExcellentDCRandcurrentcarryingcharacteristics. •Multilayermonolithicconstructionyieldshighreliability •Tighttolerancedownto±0.1nH Applica | ABRACON Abracon Corporation | ABRACON | ||
THINFILMCHIPINDUCTOR | ABRACON Abracon Corporation | ABRACON | ||
THINFILMCHIPINDUCTOR | ABRACON Abracon Corporation | ABRACON | ||
THINFILMCHIPINDUCTOR | ABRACON Abracon Corporation | ABRACON | ||
THINFILMCHIPINDUCTOR | ABRACON Abracon Corporation | ABRACON | ||
THINFILMCHIPINDUCTOR | ABRACON Abracon Corporation | ABRACON | ||
THINFILMCHIPINDUCTOR | ABRACON Abracon Corporation | ABRACON | ||
CCFH0402WIREWOUNDCOIL | AITCOMPONENTS AIT Components Ltd. | AITCOMPONENTS | ||
ThisspecificationappliestoWireWoundCeramicChipInductors | LEIDITECHShanghai Leiditech Electronic Technology Co., Ltd 雷卯电子上海雷卯电子科技有限公司 | LEIDITECH |
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
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