首页 >CR3017L>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Decoder/Driver/TimingGeneratorforColorLCDPanels Description TheCXA3017RisanICdesignedtodrivethecolorLCDpanelsLCX005BK/BKB,LCX009AK/AKB,LCX024AK/AKB,LCX027AK/AKBandDCX501BK. ThisICallowstwo-panelsimultaneousandswitchingdrivebysimultaneouslyoutputtingthetimingpulsesfortheLCX005BK/BKB,LCX009AK/AKB,LCX024AK/AKB, | SonySony Semiconductor Solutions Group 索尼 | Sony | ||
CDDigitalSignalProcessorwithBuilt-inDigitalServoandDAC Description TheCXD3017QisadigitalsignalprocessorLSIforCDplayers.ThisLSIincorporatesadigitalservo,digitalfilter,zerodetectioncircuit,1-bitDACandanaloglow-passfilter. Features DigitalSignalProcessor(DSP)Block •1×,2×,4×speedplaybacksupported •16K-RAM •EFM | SonySony Semiconductor Solutions Group 索尼 | Sony | ||
EZ-USBSX3:ConfigurableSuperSpeedUSBController Features ■UniversalSerialBus(USB)integration ❐USB3.2,Gen1andUSB2.0peripheralscompliantwith USB3.2SpecificationRevision1.0 ❐5-GbpsSuperSpeedPHYcompliantwithUSB3.2Gen1 ❐Threephysicalendpoints ❐SupportsUVC,UAC,andUSBvendorclassprotocol ■GeneralConfigura | InfineonInfineon Technologies AG 英飞凌英飞凌科技股份公司 | Infineon | ||
EZ-USBSX3:ConfigurableSuperSpeedUSBController Features ■UniversalSerialBus(USB)integration ❐USB3.2,Gen1andUSB2.0peripheralscompliantwith USB3.2SpecificationRevision1.0 ❐5-GbpsSuperSpeedPHYcompliantwithUSB3.2Gen1 ❐Threephysicalendpoints ❐SupportsUVC,UAC,andUSBvendorclassprotocol ■GeneralConfigura | InfineonInfineon Technologies AG 英飞凌英飞凌科技股份公司 | Infineon | ||
EZ-USBSX3:ConfigurableSuperSpeedUSBController Features ■UniversalSerialBus(USB)integration ❐USB3.2,Gen1andUSB2.0peripheralscompliantwith USB3.2SpecificationRevision1.0 ❐5-GbpsSuperSpeedPHYcompliantwithUSB3.2Gen1 ❐Threephysicalendpoints ❐SupportsUVC,UAC,andUSBvendorclassprotocol ■GeneralConfigura | InfineonInfineon Technologies AG 英飞凌英飞凌科技股份公司 | Infineon | ||
SurfaceMountZenerDiode Features -Forsurfacemountedapplicationsinordertooptimizeboardspace -Lowprofilepackage -Built-instrainrelief -Glasspassivatedjunction -Lowinductance -Excellentclampingcapability -TypicalIlessthan1uAabove11VD -Hightemperaturesoldering260°C/10secondsat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SurfaceMountZenerDiode Features -Forsurfacemountedapplicationsinordertooptimizeboardspace -Lowprofilepackage -Built-instrainrelief -Glasspassivatedjunction -Lowinductance -Excellentclampingcapability -TypicalIDlessthan1uAabove11V -Hightemperaturesoldering260°C/10secondsatt | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
12VAPCBMOUNTEDTRANSFORMER | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
30VP-CHANNELENHANCEMENTMODEMOSFET | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
30VP-CHANNELENHANCEMENTMODEMOSFET | DIODESDiodes Incorporated 美台半导体 | DIODES |
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