首页 >COP324C-WCW/N>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SmallSignalMOSFETTransistorN-ChannelEnhancement-ModeTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize21.65x21.65MILS DieThickness9.0MILS GateBondingPadArea5.5x5.5MILS SourceBondingPadArea5.9x13.8MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-12,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
N-ChannelEnhancement-ModeTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize21.6x21.6MILS DieThickness5.9MILS GateBondingPadArea5.5x5.5MILS SourceBondingPadArea5.9x13.8MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-12,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
GERMANIUMPNPTRANSISTORS | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
HystereticCurrent-ModeController | CHERRY Cherry Semiconductor Corporation | CHERRY | ||
Safetyswitch,generalduty,fusible,200A,3poles,60hp,240VAC,NEMA1,neutralfactoryinstalled | SCHNEIDERSchneider Electric 施耐德施耐德电气 | SCHNEIDER | ||
Safetyswitch,generalduty,fusible,200A,3poles,60hp,240VAC,NEMA3R,bolt-onprovision,neutralfactoryinstalled | SCHNEIDERSchneider Electric 施耐德施耐德电气 | SCHNEIDER | ||
ShortCircuitProtectedRegulated,3WSIPDC/DCConverters | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
D300RUSERIES | MPD MPD (Memory Protection Devices) | MPD | ||
AutomaticDicingSaw | DISCODISCO Corporation 迪斯科公司 | DISCO | ||
LOWPOWERQUADOPERATIONALAMPLIFIER LOWPOWERQUASOPERATIONALAMPLIFIER | DAEWOO Daewoo Semiconductor | DAEWOO |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
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