首页 >CMO5V0LCTR>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SMDESDProtectionDiode Features -Bi-directionalESDprotectionofoneline. -Fastresponsetime. -Lowreverseclampingvoltage. -Lowleakagecurrent. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Uni-directionalESDprotectionofoneline. -Fastresponsetime. -Lowreverseclampingvoltage. -Lowleakagecurrent. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0503. -Highcomponentdensity. Mechanicaldata -Case:0503(1308)standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Bi-directionalESDprotection. -Surfacemountpackage. -Operatingvoltage:5V. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Bi-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0503. -Highcomponentdensity. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Bi-directionalESDprotection -IEC61000-4-5(surge);IPP=7A -IEC61000-4-2(ESD);±30KV(contact) -Lowclampingvoltage -Lowleakagecurrent Mechanicaldata -Case:0503/SOD-723FStandardpackage,moldedplastic. -Terminals:Goldplated,solder | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features Uni-directionalESDprotection IEC61000-4-215kV(contact),20kV(air). Workingvoltage:5V UltrasmallSMDpackage:0503. Highcomponentdensity. Mechanicaldata Case:0503(1308)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-7 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0503 -Highcomponentdensity. -IEC61000-4-2(ESD);±30KV(contact) Mechanicaldata -Case:0503/SOD-723FStandardpackage,moldedplastic. -Terminals:Goldplated, | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features Bi-diretionalESDprotection. (16kV)IEC61000-4-2rating. Surfacemountpackage. UltrasmallSMDpackage:0503. Highcomponentdensity. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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