T-1 Wire Terminal (standard)

T-1 Wire Terminal (standard) T-1 Sub-Midget Flange Base

文件：226.72 Kbytes 页数：1 Pages

CML

Sub-Midget Flange Base, Wire Terminal

文件：33.95 Kbytes 页数：1 Pages

VCC

Variety of connection options for fast

文件：215.29 Kbytes 页数：3 Pages

VCC

Small Signal Transistor PNP - High Current Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 40 x 40 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 7.9 x 8.7 MILS Emitter Bonding Pad Area 9.0 x 14 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：210.76 Kbytes 页数：2 Pages

Central

Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 40 x 40 MILS Die Thickness 7.0 MILS Base Bonding Pad Area 7.9 x 8.7 MILS Emitter Bonding Pad Area 9.0 x 14 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：463.32 Kbytes 页数：2 Pages

Central