Featuring world-class product variations and ease of SMD assembly. Ultra-small Chip-LEDs for use in various electronic products.

1. All are SMD(surface mount device) LED lamps. 2. Varieties range from the standard to very small and ultra-small sizes and high density mounting is available. 3. There are standard brightness type, super brightness type and ultra brightness type. 4. Automated chip machine mounting allows f

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CITIZEN

西铁城电子株式会社

Metal Oxide Varistors

Features • Fast response • Excellent voltage ratio • High stabilization for circuit voltage • Unparalleled absorption for transient voltage characteristics • Bilateral and symmetrical V-1 characteristics curve Applications • Surge Protection in consumer electronics – industrial electroni

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ETCList of Unclassifed Manufacturers

未分类制造商

Small Signal Transistor

PROCESS DETAILS Process EPITAXIAL BASE Die Size 39.5 X 39.5 MILS Die Thickness 9.8 MILS Base Bonding Pad Area 3.9 x 5.1 MILS Emitter Bonding Pad Area 7.9 x 3.9 MILS Top Side Metalization Al - 24,000Å Back Side Metalization Au - 12,000Å

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Central

Coils and Chokes for general use

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PREMO

普莱默