首页 >CH316Q>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
2.5AmpGateDriveOptocouplerwithIntegrated(VCE)DesaturationDetectionandFaultStatusFeedback Description Avago’s2.5AmpGateDriveOptocouplerwithIntegratedDesaturation(VCE)DetectionandFaultStatusFeedbackmakesIGBTVCEfaultprotectioncompact,affordable,andeasy-to-implementwhilesatisfyingworldwidesafetyandregulatoryrequirements. Features 2.5Amaximumpeak | AVAGOAVAGO TECHNOLOGIES LIMITED 安华高 | AVAGO | ||
T-31/4MiniatureBayonetBase T-31/4MiniatureBayonetBase | CML Chicago Miniature Lamp,inc | CML | ||
MiniatureBayonetBase | VCC Visual Communications Company | VCC | ||
6-20GHzLowNoiseAmplifier KeyFeatures •LowNoiseFigure •HighGainBroadbandPerformance •SingleSupplyVoltage •SmallDieSize | QORVOQorvo, Inc 威讯联合威讯联合半导体(德州)有限公司 | QORVO | ||
SmallSignalTransistorNPN-HighVoltageTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize20x20MILS DieThickness9.0MILS BaseBondingPadArea4.0x4.0MILS EmitterBondingPadArea4.7x4.7MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-18,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
SmallSignalTransistorsNPN-HighVoltageTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize20x20MILS DieThickness7.1MILS BaseBondingPadArea4.0x4.0MILS EmitterBondingPadArea4.7x4.7MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-18,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
GERMANIUMPNPTRANSISTORS | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
D300RUSERIES | MPD MPD (Memory Protection Devices) | MPD | ||
Single&DualOutput3WSIP,WideInputDC/DCConverters | MPD MPD (Memory Protection Devices) | MPD | ||
75WattMedicalGradeAutomobilePowerAdapter | ASTRODYNEAstrodyne Corporation 天成达天成达(昆山)电子有限公司 | ASTRODYNE |
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