CEM500_V01

COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ●6thgenIntel®Xeon®andCore™i7/i5/i3processors(Skylake-H) ●Intel®CM236/QM170/HM170chipset ●2DDR4-2133SO-DIMM,upto32GBECCornon-ECC ●1xPCIex16and8xPCIex1Gen.3 ●4SATA-600withRAID0/1/5/10 ●4USB3.0and8USB2.0 ●Intel®AMT11.0andTPM1.2support

DCAN500_V01

CANOverPowerlineTransceiver

GI500_V01

GeneralPurposePlasticRectifier

FEATURES •Lowforwardvoltagedrop •Lowleakagecurrent,IRlessthan0.1μA •Highforwardsurgecapability •Solderdip275°Cmax.10s,perJESD22-B106 •Materialcategorization:Fordefinitionsof compliancepleaseseewww.vishay.com/doc?99912 TYPICALAPPLICATIONS Foruseingene

IMB500_V01

ATXMotherboardwithLGA1151Socket7th/6thGenIntel®Core™Processor,Intel®Q170,USB3.2Gen1x1,SATA3.0,DualLAN,VGA,DisplayPort,HDMIandmSATA

Features ●LGA1151socket7th/6thgenIntel®Core™i7/i5/i3,Pentium®&Celeron®processor(KabyLake/Skylake) ●Four288-pinDDR4-2400/2133/1866DIMMforupto64GBofmemory ●DisplayPort,HDMIandVGAwithtriple-viewsupported ●5SATA-600withRAID0/1/5/10 ●4USB3.2Gen1x1(5Gbps)and

INA500_V01

INA500CostandSizeOptimized,LowPower,1.7Vto5.5VDifferenceAmplifierwith1MΩ>>1MΩInputImpedance

1Features •Optimizedforsmall-size,low-power,andlow-cost •>1MΩUltra-highinputimpedance •Threegainoptions(G=1,0.50,and0.25) •Goodprecisionfor8-bitto12-bitsystems –CMRR:87dB(typical) –Gainerror:±0.01(typical) –Offsetvoltage:±0.70mV(typical) •Spacesaving

MANO500_V01

Mini-ITXSBCwithLGA1151Socket6th/7thGenIntel®Core™Processor,Intel®H110/Q170,HDMI/DisplayPort/VGA/LVDS/eDP,DualLANsandUSB3.0

Features ●LGA1151socket6th/7thgenIntel®Core™i7/i5/i3,Pentium®&Celeron®processor(Skylake/KabyLake) ●Intel®H110/Q170chipset ●2DDR4-2133Long-DIMM,upto32GB ●1PCIex16slot ●1PCIExpressMiniCardslotandSIMcardslot ●3SATA-600and1mSATA ●4USB3.0and4USB2.0

USM-500_V01

ProfessionalTower/StandaloneMedicalComputerwithNVIDIAIGX

Features ƒStylishanduserfriendlyoutlookforhospitalenvironment ƒHarnessthepoweroftheNVIDIAIGXadvancedfunctionalsafetyandsecurity platformformedicalAIapplications ƒIGXispoweredbytheworld’smostpowerfulAIcomputerforenergy-efficient autonomousmachineswith275

VS-VSKDF500_V01

FREDPt®Gen4DoublerUltrafastDiode,500A(INT-A-PAKPowerModules)S

FEATURES •Gen4FREDPt®dicestechnology •Ultrasoftreverserecoverycharacteristics •LowIRRMandreverserecoverycharge •Verylowforwardvoltagedrop •175°Coperatingjunctiontemperature •ULapprovedfileE78996forapplicationwithmaximum casetemperatureupto140°C •Larg

VS-VSKEF500_V01

FREDPt짰Gen4SingleUltrafastDiode,500A(INT-A-PAKPowerModules)

FEATURES •Gen4FREDPt®dicestechnology •Ultrasoftreverserecoverycharacteristics •LowIRRMandreverserecoverycharge •Verylowforwardvoltagedrop •175°Coperatingjunctiontemperature •ULapprovedfileE78996forapplicationwithmaximum casetemperatureupto140°C •Larg

VS-VSKS500_V01

SingleThyristor(MAGN-A-PAKBlockPowerModule),500A

FEATURES •Electricallyisolatedbaseplate •3000VRMSisolatingvoltage •Industrialstandardpackage •Simplifiedmechanicaldesigns,rapidassembly •Highsurgecapability •Largecreepagedistances •ULapprovedfileE78996 •Materialcategorization:fordefinitionsofcompliance ple