COM Express Type 6 Application Board with LVDS, VGA, DDI, Dual LANs and Audio

Features ● 125 x 95 mini size form factor ● 2 GbE LANs ● SATA-600 ● LVDS, VGA and DDI ● 4 USB 2.0 and 2 USB 3.0 ● 2 PCI Express Mini Card slots ● 3 RS-232/422/485 and 1 RS-232

文件：406.67 Kbytes 页数：1 Pages

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COM Express Type 6 Application Board with MXM Slot

Features ● MXM type A supported ● SATA-600 ● LVDS, VGA, HDMI, and DisplayPort ● 4 USB 2.0 and 2 USB 3.0 ● 2 PCI Express Mini Card slots ● 3 RS-232/422/485 and 1 RS-232

文件：376.58 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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Processor COM Express Type 6 Module with Intel QM170/HM170

文件：294.04 Kbytes 页数：1 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

文件：338.24 Kbytes 页数：2 Pages

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