首页 >CCC001>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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CLASSCC/CDCCMRSERIESFUSES Description TheCCMRseriesisidealforspacesavingprotection ofmotorsupto40hp*.Itwasdesignedspecificallyto withstandsustainedstartingcurrentsofsmallmotors.The CCMR60fuseisthesmallest60Afuseavailableratedat 600V.ComparedtootherULListedfuses,ClassCCfuse | Littelfuselittelfuse 力特力特公司 | Littelfuse | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL- | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method2026 Polarity:Indicated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method20 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurgewithstand,highreliability. Mechanicaldata Case:1206(3216)standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,metho | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
CF001SERIESGAASPSEUDOMORPHICHEMTANDMESFETCHIPS | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
GaAsPseudomorphicHEMTandMESFETChips CF001SeriesGaAsPseudomorphicHEMTandMESFETChips | MIMIX Mimix Broadband | MIMIX | ||
AMCERAMICFILTERSWITHMATCHINGCOIL | Toko TOKO, Inc | Toko |
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