CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to +

文件：2.04257 Mbytes 页数：35 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

文件：806.2 Kbytes 页数：13 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

文件：806.2 Kbytes 页数：13 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to +

文件：2.04257 Mbytes 页数：35 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器