CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

丝印：CC3301ENJA；Package：WQFN；CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

SimpleLink™ Wi-Fi 6 和低功耗 Bluetooth® 配套 IC

SimpleLink™ Wi-Fi CC33xx 系列器件兼具经济性和可靠性，可支持工程师放心地连接更多应用。CC33xx 是单芯片 Wi-Fi 6 和低功耗蓝牙 5.3 器件。CC3300 和 CC3301 是此引脚对引脚兼容系列中的首批器件。\n\n CC3300：2.4GHz Wi-Fi 6 配套 IC。\n\n CC3301：2.4GHz Wi-Fi 6 和低功耗蓝牙 5.3 配套 IC。\n\n CC330x 提供 Wi-Fi 和 BLE 的最新标准，同时与 Wi-Fi 4 (802.11 b/g/n) 和 Wi-Fi 5 (802.11ac) 保持兼容。这些 CC330 • Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.2 system for low-cost industrial embedded applications\n• Wi-Fi 6 \n• TWT and OFDMA for improved efficiency \n• Excellent interoperability \n• Bluetooth Low Energy 5.2 \n• Host controller interface (HCI) transport for Bluetooth with option for ;

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

文件：1.24206 Mbytes 页数：31 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

文件：806.2 Kbytes 页数：13 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

文件：806.2 Kbytes 页数：13 Pages

TI

德州仪器

SimpleLink™ Wi-Fi 6 和低功耗 Bluetooth® 配套模块

SimpleLink™ Wi-Fi CC33xx 系列器件兼具经济性和可靠性，可支持工程师放心地连接更多应用。CC330xMOD 是经过认证的模块，旨在简化硬件设计并缩短上市时间。\n\n CC3300MOD：2.4GHz Wi-Fi 6 配套模块 CC3301MOD：2.4GHz Wi-Fi 6 和低功耗蓝牙 5.4 配套模块 CC330xMOD 提供 Wi-Fi 和 BLE 的最新标准，同时与 Wi-Fi 4 (802.11 b/g/n) 和 Wi-Fi 5 (802.11ac) 保持兼容。这些 CC330xMOD 基于德州仪器 (TI) 的第 10 代连接组合芯片。因此，CC330xMO 主要特性 \n \nWi-Fi 6 (802.11ax)\n \nCC33x1MOD 提供低功耗 Bluetooth 5.4\n \n是能够运行 TCP/IP 协议栈的任何处理器或 MCU 主机的配套模块\n \n集成 2.4GHz PA，适用于输出功率高达 +18dBm 的完整无线系统\n \n工作温度：-40°C 至 +85°C\n \n应用吞吐量高达 50Mbps\n \n监管认证（正在认证） \n \nFCC\n \nIC/ISED\n \nETSI/CE\n \nTELEC\n \n\n \n符合 QuickTrack 标准\n \n符合蓝牙控制器子系统标准\n \n扩展特性 \;

TI

德州仪器