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CC2640R2FRHBR.B

丝印:CC2640R2F;Package:VQFN(RHB);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRHBT

丝印:CC2640R2F;Package:VQFN(RHB);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRHBT.A

丝印:CC2640R2F;Package:VQFN(RHB);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRHBT.B

丝印:CC2640R2F;Package:VQFN(RHB);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRSM

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRSMR

丝印:CC2640R2F;Package:VQFN(RSM);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRSMR.A

丝印:CC2640R2F;Package:VQFN(RSM);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRSMR.B

丝印:CC2640R2F;Package:VQFN(RSM);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRSMT

丝印:CC2640R2F;Package:VQFN(RSM);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

CC2640R2FRSMT.A

丝印:CC2640R2F;Package:VQFN(RSM);CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件:4.60043 Mbytes 页数:74 Pages

TI

德州仪器

技术参数

  • Features:

    LE 1M PHY

  • Type:

    Wireless MCU

  • RAM (KB):

    20

  • GPIO:

    10

  • Peripherals:

    1 UART

  • Security:

    Cryptographic acceleration

  • Sensitivity (best) (dBm):

    -97

  • Operating temperature range (C):

    -40 to 85

  • Rating:

    Catalog

供应商型号品牌批号封装库存备注价格
NA
23+
NA
26094
10年以上分销经验原装进口正品,做服务型企业
询价
TI/德州仪器
23+
QFN
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
23+
TSSOP
7300
专注配单,只做原装进口现货
询价
24+
32000
全新原厂原装正品现货,低价出售,实单可谈
询价
TI
24+
VQFN
17900
一级授权代理原装现货热卖
询价
TI
VQFN32
10000
正品原装--自家现货-实单可谈
询价
TI
1725+
VQFN32
12500
只做原装进口,假一罚十
询价
TI
23+
NA
19587
专业电子元器件供应链正迈科技特价代理特价,原装元器件供应,支持开发样品
询价
TI
23+
VQFN48
8600
受权代理!全新原装现货特价热卖!
询价
更多CC2640供应商 更新时间2026-1-26 17:18:00