CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件：1.75518 Mbytes 页数：51 Pages

TI

德州仪器

丝印：CC2640；Package：DSBGA(YFV)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640；Package：DSBGA(YFV)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640；Package：DSBGA(YFV)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640；Package：DSBGA(YFV)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU

CC2640 器件是一款无线微控制器 (MCU)，主要适用于 Bluetooth® 低功耗 应用。此器件属于 SimpleLink™ CC26xx 系列中的经济高效型超低功耗 2.4GHz RF 器件。它具有极低的有源 RF 和 MCU 电流以及低功耗模式流耗，可确保卓越的电池使用寿命，适合小型纽扣电池供电以及在能源采集型应用中 使用。 SimpleLink Bluetooth 低功耗 CC2640 器件含有一个 32 位 ARM® Cortex®-M3 内核（与主处理器工作频率同为 48MHz），并且具有丰富的外设功能集，其中包括一个独特的超低功耗传感器控制器。此传感器控制器非常适合连接外部 • 微控制器 \n• EEMBC CoreMark评分：142\n• 128KB 系统内可编程闪存\n• 高达 28KB 系统 SRAM，其中 20KB 为超低泄漏静态随机存取存储器 (SRAM)\n• 2 引脚 cJTAG 和 JTAG 调试\n• 超低功耗传感器控制器 \n• 16 位架构 \n• 高效代码尺寸架构，只读存储器 (ROM) 中装载驱动程序、Bluetooth 低功耗控制器、 和引导加载程序\n• 4mm × 4mm RSM VQFN32 封装（10 个 GPIO）\n• 7mm × 7mm RGZ VQFN48 封装（31 个 GPIO） \n• 外设 \n• 四个通用定时;

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

丝印：CC2640F128；Package：VQFN(RGZ)；CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

丝印：CC2640F128；Package：VQFN(RGZ)；CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器