丝印：CC2640；Package：DSBGA(YFV)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes 页数：64 Pages

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器