Multistandard Wireless MCU

文件：2.24538 Mbytes 页数：59 Pages

TI

德州仪器

丝印：CC2650F128；Package：VQFN；Multistandard Wireless MCU

文件：2.00907 Mbytes 页数：64 Pages

TI

德州仪器

Package：32-VFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频收发器 IC 描述：IC RF TXRX+MCU 802.15.4 32VQFN

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器