超大电流型

Fenghua

风华高科

EMI SOLOTION PRODUCTS-RoHS

文件：64.47 Kbytes 页数：3 Pages

FENGJUI

峰瑞科技

MULTILAYER CHIP BEAD

●FEATURE 1. Small size chips generating high impedance 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATION

文件：167.9 Kbytes 页数：3 Pages

AITSEMI

创瑞科技

MULTILAYER FERRITE CHIP BEADS

文件：1.12807 Mbytes 页数：6 Pages

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