CAA572数据表ic资料原装现货东电化TDK第6页-114ic电子网

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型号	下载订购	功能描述	制造商上传企业	LOGO
CAA572C0G1V225G670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G1V225J640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G1V225J670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G1V225M640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G1V225M670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G2A0R5G640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G2A0R5G670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G2A0R5J640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G2A0R5J670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK
CAA572C0G2A0R5M640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie 文件：416.33 Kbytes 页数：6 Pages	TDK 东电化	TDK

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技术参数

额定电压：
630VDC
温度特性?：
C0G(0±30ppm/°C)
Q (Min.)：
1000
绝缘电阻 (Min.)：
2500MΩ

供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市显胜光电科技有限公司	CAA572X7T2V225M640LJ	TDK			100000		询价
北京天阳诚业科贸有限公司	CAA572X7T2V225M640LH	TDK	24+	con	35960	查现货到京北通宇商城	询价
万三科技(深圳)有限公司	CAA572X7S2A336M640LH	TDK(东电化)	25+	封装	500000	源自原厂成本,高价回收工厂呆滞	询价
深圳市小泽科技电子有限公司	CAA572X7R1E107M670LH	TDK/东电化	25+	SMD	2640000	QQ全天询价/耐高温/防断裂专营日系/支持小批量	询价
深圳市高捷芯城科技有限公司	CAA572C0G3A443J640LJ	TDK	25+	N/A	23458	样件支持,可原厂排单订货!	询价
深圳市得捷芯城科技有限公司	CAA572X7S2A336M640LH	TDK(东电化)	25+	N/A	23510	正规渠道,免费送样。支持账期,BOM一站式配齐	询价

更多CAA572供应商更新时间2026-1-17 9:32:00

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