CAA572C0G1V225J670LJ中文资料东电化数据手册PDF规格书

■FEATURES

◯Unique structure achieves high capacitance, high reliability and low resistance.

◯Metal frame relieves mechanical stress and thermal shock.

◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces.

◯Qualified based on AEC-Q200

■APPLICATION

◯X7x products: Smoothing and decoupling applications requiring high capacitance

◯C0G products: Resonant circuits for wireless power supply, OBC (On Board Charger), etc.